Invention Grant
US08389068B2 Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation
有权
使用替代氟化硼前体的硼离子注入,以及用于植入的大的硼氢化物的形成
- Patent Title: Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation
- Patent Title (中): 使用替代氟化硼前体的硼离子注入,以及用于植入的大的硼氢化物的形成
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Application No.: US12913757Application Date: 2010-10-27
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Publication No.: US08389068B2Publication Date: 2013-03-05
- Inventor: W. Karl Olander , Jose I. Arno , Robert Kaim
- Applicant: W. Karl Olander , Jose I. Arno , Robert Kaim
- Applicant Address: US CT Danbury
- Assignee: Advanced Technology Materials, Inc.
- Current Assignee: Advanced Technology Materials, Inc.
- Current Assignee Address: US CT Danbury
- Agency: Hultquist, PLLC
- Agent Steven J. Hultquist; Rosa Yaghmour
- Main IPC: C23C14/48
- IPC: C23C14/48 ; C23C14/06 ; H01L21/04 ; H01L21/425 ; C23C14/16

Abstract:
Methods of implanting boron-containing ions using fluorinated boron-containing dopant species that are more readily cleaved than boron trifluoride. A method of manufacturing a semiconductor device including implanting boron-containing ions using fluorinated boron-containing dopant species that are more readily cleaved than boron trifluoride. Also disclosed are a system for supplying a boron hydride precursor, and methods of forming a boron hydride precursor and methods for supplying a boron hydride precursor. In one implementation of the invention, the boron hydride precursors are generated for cluster boron implantation, for manufacturing semiconductor products such as integrated circuitry.
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