Invention Grant
- Patent Title: Apparatus and method for forming carbon protective layer
- Patent Title (中): 用于形成碳保护层的装置和方法
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Application No.: US13149352Application Date: 2011-05-31
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Publication No.: US08389071B2Publication Date: 2013-03-05
- Inventor: Naruhisa Nagata
- Applicant: Naruhisa Nagata
- Applicant Address: JP
- Assignee: Fuji Electric Co., Ltd.
- Current Assignee: Fuji Electric Co., Ltd.
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2007-242541 20070919
- Main IPC: H05H1/24
- IPC: H05H1/24 ; C23C16/00 ; C23C16/26

Abstract:
An apparatus and method for forming a carbon protective layer on a substrate using a plasma CVD method allows a more uniform in-plane distribution of the carbon protective layer thickness. The apparatus includes an annular anode that generates a plasma beam and a disk-shaped shield disposed between the anode and the substrate. The anode, the shield, and the substrate are concentrically arranged so that a straight line connecting the centers of the anode and the substrate is perpendicular to the deposition surface of the substrate where the carbon protective layer is to be formed. The center of the shield is also on the straight line.
Public/Granted literature
- US20110229657A1 APPARATUS AND METHOD FOR FORMING CARBON PROTECTIVE LAYER Public/Granted day:2011-09-22
Information query
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