Invention Grant
- Patent Title: Light emitting diode package and fabrication method thereof
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Application No.: US12606013Application Date: 2009-10-26
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Publication No.: US08389307B2Publication Date: 2013-03-05
- Inventor: Yu-Huan Liu
- Applicant: Yu-Huan Liu
- Applicant Address: TW
- Assignee: Everlight Electronics Co., Ltd.
- Current Assignee: Everlight Electronics Co., Ltd.
- Current Assignee Address: TW
- Agency: Han IP Law PLLC
- Agent Andy M. Han
- Priority: TW98103449A 20090204
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.
Public/Granted literature
- US20100193816A1 LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF Public/Granted day:2010-08-05
Information query
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