Invention Grant
- Patent Title: Method of manufacturing electronic device and electronic device
- Patent Title (中): 制造电子装置和电子装置的方法
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Application No.: US13127770Application Date: 2009-10-30
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Publication No.: US08389328B2Publication Date: 2013-03-05
- Inventor: Toru Meura , Hiroki Nikaido , Kenzou Maejima , Yoji Ishimura
- Applicant: Toru Meura , Kenzou Maejima , Yoji Ishimura , Mina Nikaido
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2008-285629 20081106; JP2008-310853 20081205; JP2008-310899 20081205
- International Application: PCT/JP2009/005770 WO 20091030
- International Announcement: WO2010/052871 WO 20100514
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
Provided is a method of manufacturing an electronic device having a first electronic component having a first terminal and a second electronic component having a second terminal, wherein the first electric component is electrically connected to the second electronic component by connecting the first terminal to the second terminal with solder, the method including: providing a resin layer having a flux action between the first terminal and the second terminal to obtain a laminate including the first electronic component, the second electronic component, and the resin layer, wherein a solder is provided on the first terminal or the second terminal; soldering the first terminal and the second terminal; and curing the resin layer while pressing the laminate with a pressurized fluid.
Public/Granted literature
- US20110221075A1 METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE Public/Granted day:2011-09-15
Information query
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