Apparatus for restricting moisture ingress

Invention Grant

US08389331B2 Apparatus for restricting moisture ingress 有权

Title translation: 用于限制水分进入的装置

Patent Title: Apparatus for restricting moisture ingress
Patent Title (中): 用于限制水分进入的装置
Application No.: US13593549

Application Date: 2012-08-24
Publication No.: US08389331B2

Publication Date: 2013-03-05
Inventor: Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
Applicant: Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
Applicant Address: US MN Minneapolis
Assignee: Medtronic, Inc.
Current Assignee: Medtronic, Inc.
Current Assignee Address: US MN Minneapolis
Agent Evans M. Mburu; Stephen W. Bauer
Main IPC: H01L21/00
IPC: H01L21/00

Abstract:

Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.

Abstract(Chinese):

保护电路免受水分侵入的装置和方法，例如使用金属结构作为湿气入口屏障的一部分。

Public/Granted literature

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备