Invention Grant
- Patent Title: Semiconductor device package and method of assembly thereof
- Patent Title (中): 半导体器件封装及其组装方法
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Application No.: US13244375Application Date: 2011-09-24
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Publication No.: US08389336B2Publication Date: 2013-03-05
- Inventor: Juan A. Herbsommer , Jonathan A Noquil , Osvaldo J Lopez
- Applicant: Juan A. Herbsommer , Jonathan A Noquil , Osvaldo J Lopez
- Applicant Address: US PA Bethlehem
- Assignee: Ciclon Semiconductor Device Corp.
- Current Assignee: Ciclon Semiconductor Device Corp.
- Current Assignee Address: US PA Bethlehem
- Agent Steven A. Shaw; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48
Abstract:
A semiconductor die package includes: an assembly including a semiconductor die, a clip structure attached to an upper surface of the semiconductor die, and a heat sink attached to an upper surface of the clip structure; and a molding material partially encapsulating the assembly, wherein an upper surface of the heat sink is exposed through the molding material.
Public/Granted literature
- US20120015483A1 Semiconductor Device Package and Method of Assembly Thereof Public/Granted day:2012-01-19
Information query
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