Invention Grant
- Patent Title: Patch on interposer assembly and structures formed thereby
- Patent Title (中): 内插器组件的补片和由此形成的结构
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Application No.: US12655588Application Date: 2009-12-31
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Publication No.: US08389337B2Publication Date: 2013-03-05
- Inventor: Brent M. Roberts , Mihir K. Roy , Sriram Srinivasan
- Applicant: Brent M. Roberts , Mihir K. Roy , Sriram Srinivasan
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L23/60
- IPC: H01L23/60
Abstract:
Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.
Public/Granted literature
- US20110156276A1 Patch on interposer assembly and structures formed thereby Public/Granted day:2011-06-30
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