Invention Grant
- Patent Title: Silicon germanium film formation method and structure
- Patent Title (中): 硅锗成膜方法及结构
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Application No.: US13025474Application Date: 2011-02-11
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Publication No.: US08389352B2Publication Date: 2013-03-05
- Inventor: Ashima B. Chakravarti , Abhishek Dube , Dominic J. Schepis
- Applicant: Ashima B. Chakravarti , Abhishek Dube , Dominic J. Schepis
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Katherine S. Brown
- Main IPC: H01L21/8238
- IPC: H01L21/8238

Abstract:
Epitaxial deposition of silicon germanium in a semiconductor device is achieved without using masks. Nucleation delays induced by interactions with dopants present before deposition of the silicon germanium are used to determine a period over which an exposed substrate surface may be subjected to epitaxial deposition to form a layer of SiGe on desired parts with substantially no deposition on other parts. Dopant concentration may be changed to achieve desired thicknesses within preferred deposition times. Resulting deposited SiGe is substantially devoid of growth edge effects.
Public/Granted literature
- US08354314B2 Silicon germanium film formation method and structure Public/Granted day:2013-01-15
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