Invention Grant
US08389396B2 Method for manufacture of integrated circuit package system with protected conductive layers for pads 有权
用于制造具有用于焊盘的保护导电层的集成电路封装系统的方法

Method for manufacture of integrated circuit package system with protected conductive layers for pads
Abstract:
A method for manufacture of an integrated circuit package system includes: providing an integrated circuit die having a contact pad; forming a protection cover over the contact pad; forming a passivation layer having a first opening over the protection cover with the first opening exposing the protection cover; developing a conductive layer over the passivation layer; forming a pad opening in the protection cover for exposing the contact pad having the conductive layer partially removed; and an interconnect directly on the contact pad and only adjacent to the protection cover and the passivation layer.
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