Method of manufacturing a wiring board

Invention Grant

US08389414B2 Method of manufacturing a wiring board 有权

Title translation: 制造布线板的方法

Please log in to see more content

Patent Title: Method of manufacturing a wiring board
Patent Title (中): 制造布线板的方法
Application No.: US13026651

Application Date: 2011-02-14
Publication No.: US08389414B2

Publication Date: 2013-03-05
Inventor: Katsumi Kikuchi , Shintaro Yamamichi , Hideya Murai , Takuo Funaya , Kentaro Mori , Takehiko Maeda , Hirokazu Honda , Kenta Ogawa , Jun Tsukano
Applicant: Katsumi Kikuchi , Shintaro Yamamichi , Hideya Murai , Takuo Funaya , Kentaro Mori , Takehiko Maeda , Hirokazu Honda , Kenta Ogawa , Jun Tsukano
Applicant Address: JP Tokyo JP Kanagawa
Assignee: NEC Corporation,Renesas Electronics Corporation
Current Assignee: NEC Corporation,Renesas Electronics Corporation
Current Assignee Address: JP Tokyo JP Kanagawa
Agency: Young & Thompson
Priority: JP2006-181257 20060630
Main IPC: H01L21/311
IPC: H01L21/311

Abstract:

A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the insulating layer to connect the wiring layers. Of the wiring layers, a surface wiring layer formed in one surface of the insulating layer include a first metal film exposed from the one surface and a second metal film embedded in the insulating layer and stacked on the first metal film. Edges of the first metal film project from edges of the second metal film in the direction in which the second metal film spreads. By designing the shape of the wiring layers embedded in the insulating layer in this manner, it is possible to obtain a highly reliable wiring board that can be effectively prevented from side etching in the manufacturing process and can adapt to miniaturization and highly dense packaging of wires.

Abstract(Chinese):

布线基板具有绝缘层，多个布线层以通过绝缘层彼此绝缘的方式形成，以及形成在绝缘层中以连接布线层的多个通孔。在布线层中，形成在绝缘层的一个表面上的表面布线层包括从一个表面露出的第一金属膜和嵌入在绝缘层中并叠放在第一金属膜上的第二金属膜。第一金属膜的边缘沿着第二金属膜扩展的方向从第二金属膜的边缘突出。通过以这种方式设计嵌入在绝缘层中的布线层的形状，可以获得在制造过程中可以有效地防止侧蚀刻的高可靠性布线板，并且可以适应电线的小型化和高密度封装。

Public/Granted literature

US20110136298A1 METHOD OF MANUFACTURING A WIRING BOARD Public/Granted day:2011-06-09

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/30	....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/28）
H01L21/31	.....在半导体材料上形成绝缘层的，例如用于掩膜的或应用光刻技术的（密封层入H01L21/56）；以及这些层的后处理；这些层的材料的选择
H01L21/3105	......后处理
H01L21/311	.......绝缘层的刻蚀