Invention Grant
- Patent Title: Light emitting device and light emitting device package
- Patent Title (中): 发光器件和发光器件封装
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Application No.: US12956561Application Date: 2010-11-30
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Publication No.: US08390014B2Publication Date: 2013-03-05
- Inventor: Hyo Kun Son
- Applicant: Hyo Kun Son
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates LLP
- Priority: KR10-2009-0118082 20091201
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00

Abstract:
Disclosed is a light emitting device including a second conductive semiconductor layer; an active layer on the second conductive semiconductor layer; a first semiconductor layer on the active layer, the first semiconductor layer having at least one lateral side with a step portion; and a lateral electrode on the step portion formed at the at least one lateral side of the first semiconductor layer.
Public/Granted literature
- US20110127565A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2011-06-02
Information query
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