Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13130676Application Date: 2009-11-18
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Publication No.: US08390090B2Publication Date: 2013-03-05
- Inventor: Takao Morimoto
- Applicant: Takao Morimoto
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2008-306151 20081201
- International Application: PCT/JP2009/006184 WO 20091118
- International Announcement: WO2010/064370 WO 20100610
- Main IPC: H01L31/00
- IPC: H01L31/00

Abstract:
Provided is a semiconductor device with a high breakdown voltage yield of a bipolar transistor and a high bandwidth and quantum efficiency of a light receiving element. An optical semiconductor device includes monolithically integrated transistor and light receiving element. The light receiving element includes a p-type semiconductor layer, an n-type epitaxial layer formed on the p-type semiconductor layer, and an n-type diffusion layer formed on the n-type epitaxial layer. An n-type impurity concentration of the n-type diffusion layer is 3×1018 cm−3 or less at a depth of 0.12 μm or more below a surface of the n-type diffusion layer, 1×1016 cm−3 or more at a depth of 0.4 μm or less below the surface, and 1×1016 cm−3 or less at a depth of 0.8 μm or more below the surface, and an interface between the p-type semiconductor layer and the n-type epitaxial layer is located at a depth of 0.9 μm to 1.5 μm below the surface.
Public/Granted literature
- US20110221045A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-09-15
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