Invention Grant
- Patent Title: Semiconductor structure, an integrated circuit including a semiconductor structure and a method for manufacturing a semiconductor structure
- Patent Title (中): 半导体结构,包括半导体结构的集成电路和半导体结构的制造方法
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Application No.: US13143548Application Date: 2009-02-03
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Publication No.: US08390091B2Publication Date: 2013-03-05
- Inventor: Philippe Renaud
- Applicant: Philippe Renaud
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- International Application: PCT/IB2009/051306 WO 20090203
- International Announcement: WO2010/089632 WO 20100812
- Main IPC: H01L29/47
- IPC: H01L29/47

Abstract:
A monolithic semiconductor structure includes a stack of layers. The stack includes a substrate; a first layer made from a first semiconductor material; and a second layer made from a second semiconductor material. The first layer is situated between the substrate and the second layer and at least one of the first semiconductor material and the second semiconductor material contains a III-nitride material. The structure includes a power transistor, including a body formed in the stack of layers; a first power terminal at a side of the first layer facing the second layer; a second power terminal at least partly formed in the substrate; and a gate structure for controlling the propagation through the body of electric signals between the first power terminal and the second power terminal. The structure further includes a vertical Schottky diode, including: an anode; a cathode including the substrate, and a Schottky barrier between the cathode and the anode, the Schottky barrier being situated between the substrate and a anode layer in the stack of layers.
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