Invention Grant
- Patent Title: Wafer bonding method
- Patent Title (中): 晶圆接合法
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Application No.: US11877473Application Date: 2007-10-23
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Publication No.: US08390111B2Publication Date: 2013-03-05
- Inventor: Kirby Sand
- Applicant: Kirby Sand
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L23/10
- IPC: H01L23/10
Abstract:
One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a raised ring of material positioned opposite the cover from the ring of sealing material.
Public/Granted literature
- US20080048313A1 Wafer Bonding Method Public/Granted day:2008-02-28
Information query
IPC分类:
