An imaging module includes an imaging element provided with an external terminal that is disposed at an end of the front surface on which a light-receiving surface is formed and also includes a substrate on which the imaging element is mounted. On the back surface of the imaging element, an external connecting electrode that is electrically connected to the external terminal is disposed. On the main surface of the substrate, an imaging element connecting electrode is disposed at a position opposing the external connecting electrode. The external connecting electrode is connected to the imaging element connecting electrode.