Invention Grant
- Patent Title: Head suspension
- Patent Title (中): 头部悬挂
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Application No.: US12557854Application Date: 2009-09-11
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Publication No.: US08390960B2Publication Date: 2013-03-05
- Inventor: Osamu Okawara
- Applicant: Osamu Okawara
- Applicant Address: JP Kanagawa
- Assignee: NHK Spring Co., Ltd.
- Current Assignee: NHK Spring Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Jordan and Hamburg LLP
- Priority: JP2008-243685 20080924
- Main IPC: G11B21/10
- IPC: G11B21/10 ; G11B5/596 ; G11B21/21

Abstract:
A head suspension has a piezoelectric element that deforms in response to an applied voltage, a base plate provided with an opening to which the piezoelectric element is attached, and a load beam fixed to the base plate so that a front end of the load beam moves in a sway direction according to deformation of the piezoelectric element. The head suspension includes an adhesive applied to a gap between the piezoelectric element and the opening, to attach the piezoelectric element to the opening. The adhesive has a thixotropic characteristic and is sol when applied to the gap.
Public/Granted literature
- US20100073825A1 HEAD SUSPENSION Public/Granted day:2010-03-25
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