Invention Grant
- Patent Title: Water jacket for cooling an electronic device on a board
- Patent Title (中): 用于冷却板上电子设备的水套
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Application No.: US12676224Application Date: 2007-09-14
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Publication No.: US08391006B2Publication Date: 2013-03-05
- Inventor: Koei Nishiura
- Applicant: Koei Nishiura
- Applicant Address: JP Tokyo
- Assignee: Advantest Corporation
- Current Assignee: Advantest Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- International Application: PCT/JP2007/067947 WO 20070914
- International Announcement: WO2009/034641 WO 20090319
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34 ; G01N1/22

Abstract:
A water jacket includes a channel which accommodates MCM and through which a coolant runs, and the channel has a throttle part of which a flow passage sectional area is smaller than other parts and which is at the upstream of the MCM.
Public/Granted literature
- US20100271779A1 WATER JACKET FOR COOLING AN ELECTRONIC DEVICE ON A BOARD Public/Granted day:2010-10-28
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