Invention Grant
- Patent Title: Memory module with termination component
- Patent Title (中): 具有终端组件的内存模块
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Application No.: US11280560Application Date: 2005-11-15
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Publication No.: US08391039B2Publication Date: 2013-03-05
- Inventor: Frederick A. Ware , Ely K. Tsern , Richard E. Perego , Craig E. Hampel
- Applicant: Frederick A. Ware , Ely K. Tsern , Richard E. Perego , Craig E. Hampel
- Applicant Address: US CA Sunnyvale
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Charles Shemwell
- Main IPC: G11C5/02
- IPC: G11C5/02

Abstract:
A module having first and second memory devices and a termination component. A first signal line is coupled to the first memory device to provide first data thereto, the first data to be stored in a memory array of the first memory device during a write operation. A second signal line is coupled to the second memory device to provide thereto, the second data to be stored in a memory array of the second memory device during the write operation. A control signal path is coupled to the first memory device, the second memory device and the termination component such that a write command propagating on the control signal path propagates past the first memory device and the second memory device before reaching the first termination component, wherein the write command specifies the write operation.
Public/Granted literature
- US20060077731A1 Memory module with termination component Public/Granted day:2006-04-13
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