Invention Grant
- Patent Title: Semiconductor integrated circuit
- Patent Title (中): 半导体集成电路
-
Application No.: US13210949Application Date: 2011-08-16
-
Publication No.: US08391084B2Publication Date: 2013-03-05
- Inventor: Hiroyuki Takahashi , Hidetaka Natsume
- Applicant: Hiroyuki Takahashi , Hidetaka Natsume
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2007-292878 20071112
- Main IPC: G11C7/00
- IPC: G11C7/00

Abstract:
A semiconductor integrated circuit according to one aspect of the present invention may includes a plurality of driving circuits to drive a respective plurality of word lines with either a first voltage supplied from a first power supply or a second voltage supplied from a second power supply in accordance with a control signal, and a plurality of gate transistors in each of which a gate is connected to one of the plurality of word lines, and a connection state between a storage node and a bit line is changed based on the voltage provided to the word line connected to the gate. In the semiconductor integrated circuit, a gate oxide film of each of the plurality of gate transistors is thinner than a gate oxide film of each of transistors constituting the plurality of driving circuits.
Public/Granted literature
- US20110298012A1 SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2011-12-08
Information query