Invention Grant
- Patent Title: Semiconductor device metal programmable pooling and dies
- Patent Title (中): 半导体器件金属可编程池和管芯
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Application No.: US13018055Application Date: 2011-01-31
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Publication No.: US08392865B2Publication Date: 2013-03-05
- Inventor: Behnam Malekkhosravi , David Ian West
- Applicant: Behnam Malekkhosravi , David Ian West
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Knobbe Martens Olson & Bear, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A pool of die designs includes die designs having metal programmable base layers. Die designs from the pool are selected for use in fabricating dies. Die designs are added to the pool by customization of die designs already in the pool or by preparing custom die designs that incorporate a metal programmable base layer. In some embodiments multi-tile dies are provided with I/O slots configurable for either inter tile communication or inter die communication.
Public/Granted literature
- US20110121467A1 SEMICONDUCTOR DEVICE METAL PROGRAMMABLE POOLING AND DIES Public/Granted day:2011-05-26
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