Invention Grant
- Patent Title: Electrical connection of components
- Patent Title (中): 组件的电气连接
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Application No.: US12531856Application Date: 2008-03-17
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Publication No.: US08393076B2Publication Date: 2013-03-12
- Inventor: Philip Gareth Bentley
- Applicant: Philip Gareth Bentley
- Applicant Address: GB Ossett
- Assignee: Conductive Inkjet Technology Limited
- Current Assignee: Conductive Inkjet Technology Limited
- Current Assignee Address: GB Ossett
- Agency: Morgan, Lewis & Bockius LLP
- Priority: GB0705287.1 20070320
- International Application: PCT/GB2008/000935 WO 20080317
- International Announcement: WO2008/113994 WO 20080925
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
A component is electrically connected to an electrical circuit by a method that comprises forming an intermediate product in which the component (3) is disposed on one side of an electrically conducting sheet (1) so that at least one pair of contacts (4) of the component are electrically connected by the sheet and in which a patterned etch resist layer (2) is disposed on the other side of the sheet in registration with the component on said one side of the sheet, and then exposing the other side of the sheet to an etching agent and thereby removing areas of the sheet to leave the electrical circuit and also to remove the electrical interconnection between the contacts.
Public/Granted literature
- US20100032199A1 Electrical Connection of Components Public/Granted day:2010-02-11
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