Invention Grant
- Patent Title: Wire forming apparatus
- Patent Title (中): 线材成型设备
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Application No.: US12816110Application Date: 2010-06-15
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Publication No.: US08393191B2Publication Date: 2013-03-12
- Inventor: Ichiro Itaya
- Applicant: Ichiro Itaya
- Applicant Address: JP Matsudo-shi, Chiba-ken
- Assignee: Kabushiki Kaisha Itaya Seisaku Sho
- Current Assignee: Kabushiki Kaisha Itaya Seisaku Sho
- Current Assignee Address: JP Matsudo-shi, Chiba-ken
- Agency: Merchant & Gould P.C.
- Priority: JP2009-162177 20090708
- Main IPC: B21F3/04
- IPC: B21F3/04

Abstract:
A wire forming apparatus which feeds out a wire (W) from a distal end portion of a wire guide (402), forcibly bends, curves, or winds the wire by using a forming tool (T1-T5) and forms the wire into a part with a desired shape by using a cutting tool (T0), wherein the forming tool includes a coiling tool of which a coiling spindle rotates about its central axis, a coiling tool unit (T1, T2) which rotatably supports the coiling tool and a cutting tool unit (T0) which supports a cutting blade (506) and a receiving portion (507) constituting the cutting tool so as to allow the cutting blade and the receiving portion to relatively reciprocate are attached to the tool selection table (210), and a common driving source is provided to apply driving force to the coiling tool unit and the cutting tool unit attached on the tool selection table.
Public/Granted literature
- US20110005633A1 WIRE FORMING APPARATUS Public/Granted day:2011-01-13
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