A machining method for machining a superficial portion of a laminate using machine tool having a depth limiter which restricts a maximum depth of the machine tool. A guide frame having an inner guide contour restricts a maximum dimension of the superficial portion, and is secured over the superficial portion. The superficial portion is machined while the machine tool is guided by the guide contour. From another point of view, a machining apparatus for machining a superficial portion of a material is provided. The machining apparatus comprises a guide frame, an inner guide contour for guiding a machine tool, an attachment member for securing the guide frame to an attachment member, adjacent to the superficial portion, of the material.