Invention Grant
US08394245B2 Production apparatus for electro-deposited metal foil, production method of thin plate insoluble metal electrode used in production apparatus for electro-deposited metal foil, and electro-deposited metal foil produced by using production apparatus for electro-deposited metal foil
有权
电沉积金属箔的制造装置,用于电沉积金属箔的制造装置中使用的薄板不溶性金属电极的制造方法以及使用电沉积金属箔的制造装置制造的电沉积金属箔
- Patent Title: Production apparatus for electro-deposited metal foil, production method of thin plate insoluble metal electrode used in production apparatus for electro-deposited metal foil, and electro-deposited metal foil produced by using production apparatus for electro-deposited metal foil
- Patent Title (中): 电沉积金属箔的制造装置,用于电沉积金属箔的制造装置中使用的薄板不溶性金属电极的制造方法以及使用电沉积金属箔的制造装置制造的电沉积金属箔
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Application No.: US12751055Application Date: 2010-03-31
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Publication No.: US08394245B2Publication Date: 2013-03-12
- Inventor: Yusuke Ozaki , Akira Kunimatsu
- Applicant: Yusuke Ozaki , Akira Kunimatsu
- Applicant Address: JP Kanagawa
- Assignee: Permelec Electrode Ltd.
- Current Assignee: Permelec Electrode Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: The Webb Law Firm
- Priority: JP2009-089528 20090401
- Main IPC: C25D17/10
- IPC: C25D17/10 ; C25D17/12

Abstract:
An object of the present invention is to provide a production apparatus for electro-deposited metal foil or the like that can reduce thickness fluctuation of electro-deposited metal foil. To achieve the object, a production apparatus for electro-deposited metal foil or the like in which a cathode and an insoluble anode apart from each other, supplying an electrolytic solution through a gap between the cathode and the anode, making the cathode move along to the insoluble anode, electrodepositing a metal component on an electro-deposition surface of the moving cathode is applied. Wherein the insoluble anode is a thin plate insoluble metal electrode provided with a conductive electrode material coating layer on a surface of a substrate made of a corrosion-resistant material, and detachably mounted to an electrode base by using predetermined fixing means, and the conductive electrode material coating layer of the thin plate insoluble metal electrode is provided with a conductive electrode material stripped belt in a direction perpendicular to a moving direction of the cathode, and the fixing means is provided in the conductive electrode material stripped belt.
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