Invention Grant
- Patent Title: Two-dimensional arrays of holes with sub-lithographic diameters formed by block copolymer self-assembly
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Application No.: US11657273Application Date: 2007-01-24
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Publication No.: US08394483B2Publication Date: 2013-03-12
- Inventor: Dan B. Millward
- Applicant: Dan B. Millward
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: B32B5/12
- IPC: B32B5/12
Abstract:
Methods for fabricating sublithographic, nanoscale microstructures in two-dimensional square and rectangular arrays utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.
Public/Granted literature
- US20080176767A1 Two-dimensional arrays of holes with sub-lithographic diameters formed by block copolymer self-assembly Public/Granted day:2008-07-24
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