A method of manufacturing a semiconductor device is disclosed. One embodiment includes placing multiple semiconductor chips onto a carrier, each of the semiconductor chips having a first face and a second face opposite to the first face. An encapsulation material is applied over the multiple semiconductor chips and the carrier to form an encapsulating body having a first face facing the carrier and a second face opposite to the first face. A redistribution layer is applied over the multiple semiconductor chips and the first face of the encapsulating body. An array of external contact elements are applied to the second face of the encapsulating body.