Invention Grant
US08394676B2 Marking method for semiconductor device and semiconductor device provided with markings
有权
具有标记的半导体器件和半导体器件的标记方法
- Patent Title: Marking method for semiconductor device and semiconductor device provided with markings
- Patent Title (中): 具有标记的半导体器件和半导体器件的标记方法
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Application No.: US12651656Application Date: 2010-01-04
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Publication No.: US08394676B2Publication Date: 2013-03-12
- Inventor: Hideaki Yamaji
- Applicant: Hideaki Yamaji
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2009-000587 20090106
- Main IPC: H01L23/24
- IPC: H01L23/24
Abstract:
A marking method is provided for putting markings on the surface of a packaged semiconductor device. The semiconductor device includes a semiconductor chip and a resin package for covering the semiconductor chip. The method includes the steps of forming a groove in the obverse surface of the resin package, and filling the groove with a resin that is visually distinguishable from the resin package.
Public/Granted literature
- US20100171214A1 MARKING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PROVIDED WITH MARKINGS Public/Granted day:2010-07-08
Information query
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