Invention Grant
- Patent Title: Memory arrays and methods of fabricating memory arrays
- Patent Title (中): 存储器阵列和制造存储器阵列的方法
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Application No.: US12828915Application Date: 2010-07-01
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Publication No.: US08394699B2Publication Date: 2013-03-12
- Inventor: Gordon A. Haller , Sanh D. Tang
- Applicant: Gordon A. Haller , Sanh D. Tang
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John, P.S.
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/3205 ; H01L21/4763

Abstract:
A memory array includes a plurality of memory cells formed on a semiconductor substrate. Individual of the memory cells include first and second field effect transistors respectively comprising a gate, a channel region, and a pair of source/drain regions. The gates of the first and second field effect transistors are hard wired together. A conductive data line is hard wired to two of the source/drain regions. A charge storage device is hard wired to at least one of the source/drain regions other than the two. Other aspects and implementations are contemplated, including methods of fabricating memory arrays.
Public/Granted literature
- US20100273303A1 Memory Arrays and Methods of Fabricating Memory Arrays Public/Granted day:2010-10-28
Information query
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