Invention Grant
- Patent Title: Method of splitting of brittle materials with trenching technology
- Patent Title (中): 用挖沟技术分解脆性材料的方法
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Application No.: US12539494Application Date: 2009-08-11
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Publication No.: US08394707B2Publication Date: 2013-03-12
- Inventor: Nicholas Horsfield
- Applicant: Nicholas Horsfield
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102005046479 20050928
- Main IPC: H01L21/46
- IPC: H01L21/46 ; H01L21/78 ; H01L21/326 ; H01L21/76 ; H01L21/302
Abstract:
One aspect of the invention relates to a method for splitting an object made of brittle material into at least two pieces. The object has a first flat surface and a second flat surface opposite to each other. The method includes etching at least one trench in at least one of the surfaces so as to form at least one line on the surface. The method also includes splitting the object into separate pieces along the line.
Public/Granted literature
- US20090298262A1 METHOD OF SPLITTING BRITTLE MATERIALS WITH TRENCHING TECHNOLOGY Public/Granted day:2009-12-03
Information query
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