A semiconductor package includes a semiconductor chip provided with a bonding pad disposed over a surface thereof; a through electrode passing from the surface to a second surface opposing the first surface and connected electrically with the bonding pad; and a redistribution disposed at the second surface and connected electrically with the through electrode. An embodiment of the present invention is capable of significantly reducing the thickness and volume of the semiconductor package. It is also capable of high speed operation since the path of the signal inputted and/or outputted from the semiconductor package is shortened. It is capable of stacking easily at least two semiconductor packages having a wafer level, and it is capable of significantly reducing parasitic capacitance.