Invention Grant
- Patent Title: Composite woven fabric and printed wiring board
- Patent Title (中): 复合机织布和印刷线路板
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Application No.: US12447653Application Date: 2007-11-07
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Publication No.: US08394731B2Publication Date: 2013-03-12
- Inventor: Akira Sato , Akira Fujinoki , Hiroyuki Nishimura , Tsukasa Sakaguchi
- Applicant: Akira Sato , Akira Fujinoki , Hiroyuki Nishimura , Tsukasa Sakaguchi
- Applicant Address: JP
- Assignee: Shin-Etsu Quartz Products Co., Ltd.
- Current Assignee: Shin-Etsu Quartz Products Co., Ltd.
- Current Assignee Address: JP
- Agency: Marger Johnson & McCollom, P.C.
- Priority: JP2006-306465 20061113
- International Application: PCT/JP2007/071641 WO 20071107
- International Announcement: WO2008/059741 WO 20080522
- Main IPC: D03D15/00
- IPC: D03D15/00

Abstract:
Disclosed is a printed wiring board which attains aims of printed wiring boards required for realizing high-speed, high-frequency semiconductor devices, namely a printed wiring board having low dielectric constant, low dielectric loss tangent and low linear expansion coefficient. Also disclosed is a composite woven fabric suitably used as a base material for such a printed wiring board. Specifically disclosed is a composite woven fabric containing quartz glass fibers and polyolefin fibers, in which the ratio of the quartz glass fibers to the composite woven fabric is set at 10 vol % or more and 90 vol % or less. It is preferred that the quartz glass fibers each have a filament diameter of 3 μm or more and 16 μm or less, and the composite woven fabric has a thickness of 200 μm or less.
Public/Granted literature
- US20100065316A1 COMPOSITE WOVEN FABRIC AND PRINTED WIRING BOARD Public/Granted day:2010-03-18
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