Invention Grant
- Patent Title: Electromagnetic wave shielding material, and method for manufacturing same
- Patent Title (中): 电磁波屏蔽材料及其制造方法
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Application No.: US12923186Application Date: 2010-09-08
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Publication No.: US08395059B2Publication Date: 2013-03-12
- Inventor: Yuichi Miyazaki , Yuusuke Satou , Shinya Kiura , Yukihiro Kyouden , Yusuke Hagiwara , Takeshi Nisizono , Takeaki Imaizumi
- Applicant: Yuichi Miyazaki , Yuusuke Satou , Shinya Kiura , Yukihiro Kyouden , Yusuke Hagiwara , Takeshi Nisizono , Takeaki Imaizumi
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2008-307790 20081202; JP2009-124582 20090522; JP2009-260316 20091113
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
The present invention is to provide an electromagnetic wave shielding material including a transparent substrate and a convex pattern layer composed of a conductive composition formed in a prescribed pattern on the transparent substrate, wherein the conductive composition contains conductive particles and a binder resin; and in observation of a transverse cross section of the convex pattern layer by electron microscopic photography, at least a part of the conductive particles has a fused continuation and a method for manufacturing the same. The electromagnetic wave shielding material and the method for manufacturing the same include a configuration capable of achieving a lower surface resistivity in an electromagnetic wave shielding material which is required to achieve a much more reduction in a line width of the pattern, specifically, a reduction to a line width of not more than 30 μm, and more preferably not more than 15 to 20 μm and a treatment method capable of reducing the surface resistivity by an easy and short-time treatment.
Public/Granted literature
- US20110122596A1 Electromagnetic wave shielding material, and method for manufacturing same Public/Granted day:2011-05-26
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