Invention Grant
- Patent Title: Compound semiconductor epitaxial substrate and manufacturing method thereof
- Patent Title (中): 复合半导体外延基板及其制造方法
-
Application No.: US13154624Application Date: 2011-06-07
-
Publication No.: US08395187B2Publication Date: 2013-03-12
- Inventor: Tsuyoshi Nakano , Masahiko Hata
- Applicant: Tsuyoshi Nakano , Masahiko Hata
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Chemical Company, Limited
- Current Assignee: Sumitomo Chemical Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2003-033466 20030212
- Main IPC: H01L31/062
- IPC: H01L31/062 ; H01L31/113 ; H01L29/06 ; H01L21/336

Abstract:
A compound semiconductor epitaxial substrate having a pseudomorphic high electron mobility field effect transistor structure including an InGaAs layer as a strained channel layer and an AlGaAs layer containing n type impurities as a front side electron-donating layer, wherein said substrate contains an InGaP layer in an orderly state on the front side of the above described InGaAs layer as the strained channel layer.
Public/Granted literature
- US20110233614A1 COMPOUND SEMICONDUCTOR EPITAXIAL SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-09-29
Information query
IPC分类: