Invention Grant
- Patent Title: Semiconductor integrated circuit device
- Patent Title (中): 半导体集成电路器件
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Application No.: US12656694Application Date: 2010-02-12
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Publication No.: US08395189B2Publication Date: 2013-03-12
- Inventor: Junichi Yamada
- Applicant: Junichi Yamada
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2009-033046 20090216
- Main IPC: H01L27/118
- IPC: H01L27/118

Abstract:
A semiconductor integrated circuit includes a group of wirings routed at first to Nth (N being an integer not less than two) wiring positions sequentially arranged in parallel, each of the wirings being divided into two portions comprising a starting end side and a terminating end side; and an Mth buffer circuit that connects the starting end side of the wiring at the Mth wiring position (M being an integer that satisfies 1≦M≦K, wherein K is an integer that satisfies K≦N/2) as an input and the terminating end side of the wiring at the (M+N−K)th wiring position as an output. The group of the wirings has a structure in which connection is switched so that the starting end side of the wiring at a Jth (J being an integer that satisfies K
Public/Granted literature
- US20100207169A1 Semiconductor integrated circuit device Public/Granted day:2010-08-19
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