A ferro-electric random access memory (FRAM) chip, including a substrate; a first dielectric layer over the substrate; a gate over the first dielectric layer; a first aluminum oxide layer over the first dielectric layer and the gate; a second dielectric layer over the first aluminum oxide layer; a trench through the second dielectric layer and the first aluminum oxide layer to the gate; a hydrogen barrier liner over the second dielectric layer and lining the trench, and contacting the gate; and a silicon dioxide plug over the hydrogen barrier liner substantially filling the trench.