Invention Grant
- Patent Title: Semiconductor device and fabrication method for the same
- Patent Title (中): 半导体器件及其制造方法相同
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Application No.: US13167362Application Date: 2011-06-23
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Publication No.: US08395219B2Publication Date: 2013-03-12
- Inventor: Riichirou Mitsuhashi , Takayuki Yamada
- Applicant: Riichirou Mitsuhashi , Takayuki Yamada
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-172572 20080701; JP2008-283607 20081104
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
The semiconductor device includes a first transistor and a second transistor formed in a semiconductor substrate. The first transistor includes: a first gate insulating film formed on the semiconductor substrate; and a first gate electrode formed on the first gate insulating film. The second transistor includes: a second gate insulating film formed on the semiconductor substrate; and a second gate electrode formed on the second gate insulating film. The first gate insulating film includes a first insulating material with a first element diffused therein, the second gate insulating film includes the first insulating material, and the amount of the first element contained in the first gate insulating film is greater than the amount of the first element contained in the second gate insulating film.
Public/Granted literature
- US20110248346A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME Public/Granted day:2011-10-13
Information query
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