Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12498674Application Date: 2009-07-07
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Publication No.: US08395230B2Publication Date: 2013-03-12
- Inventor: Hiroki Hozumi , Yuji Sasaki , Shusaku Yanagawa
- Applicant: Hiroki Hozumi , Yuji Sasaki , Shusaku Yanagawa
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: The Chicago Technology Law Group, LLC.
- Agent Robert J. Depke
- Priority: JP2008-205325 20080808
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/20 ; H01L21/768

Abstract:
A semiconductor device includes: a first semiconductor region of a first conductivity type disposed on the side of a first electrode; and a second semiconductor region having first pillar regions of the first conductivity type and second pillar regions of a second conductivity type, the first pillar regions and the second pillar regions being provided in paired state and alternately, in a device portion and a terminal portion surrounding the device portion, along a surface on the side of a second electrode disposed on the opposite side of the first semiconductor region from the first electrode. The semiconductor device further includes a lateral RESURF (reduced surface field) region of the second conductivity type disposed at a surface portion, on the opposite side from the first semiconductor region, of the second semiconductor region in the terminal portion.
Public/Granted literature
- US20100032791A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-02-11
Information query
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