Invention Grant
- Patent Title: Surface passivation by quantum exclusion using multiple layers
- Patent Title (中): 通过使用多层次的量子排除进行表面钝化
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Application No.: US13160534Application Date: 2011-06-15
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Publication No.: US08395243B2Publication Date: 2013-03-12
- Inventor: Michael E. Hoenk
- Applicant: Michael E. Hoenk
- Applicant Address: US CA Pasadenca
- Assignee: California Institute of Technology
- Current Assignee: California Institute of Technology
- Current Assignee Address: US CA Pasadenca
- Agency: Milstein Zhang & Wu LLC
- Agent Joseph B. Milstein
- Main IPC: H01L23/58
- IPC: H01L23/58

Abstract:
A semiconductor device has a multilayer doping to provide improved passivation by quantum exclusion. The multilayer doping includes a plurality M of doped layers, where M is an integer greater than 1. The dopant sheet densities in the M doped layers need not be the same, but in principle can be selected to be the same sheet densities or to be different sheet densities. M−1 interleaved layers provided between the M doped layers are not deliberately doped (also referred to as “undoped layers”). Structures with M=2, M=3 and M=4 have been demonstrated and exhibit improved passivation.
Public/Granted literature
- US20110304022A1 SURFACE PASSIVATION BY QUANTUM EXCLUSION USING MULTIPLE LAYERS Public/Granted day:2011-12-15
Information query
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