Invention Grant
- Patent Title: Integrated MEMS and CMOS package and method
- Patent Title (中): 集成MEMS和CMOS封装及方法
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Application No.: US12945087Application Date: 2010-11-12
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Publication No.: US08395252B1Publication Date: 2013-03-12
- Inventor: Xiao “Charles” Yang
- Applicant: Xiao “Charles” Yang
- Applicant Address: US CA San Jose
- Assignee: mCube Inc.
- Current Assignee: mCube Inc.
- Current Assignee Address: US CA San Jose
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
An apparatus for packaging MEMS and ICs can include a semiconductor substrate, one or more MEMS devices, an enclosure, and one or more bonding structures. The semiconductor substrate can be bonded to a portion of the surface region. The semiconductor substrate can include one or more integrated circuits. Also, the semiconductor substrate can have an upper surface region. The one or more MEMS devise can overlie an inner region of the upper surface region formed by the semiconductor substrate. The enclosure can house the one or more MEMS devices. The enclosure can overlie a first outer region of the upper surface region. Also, the enclosure can have an upper cover region. The one or more bonding structures can be provided within a second outer region of the supper surface region.
Information query
IPC分类:
