Invention Grant
US08395256B2 Packaging for low-cost, high-performance microwave and millimeter wave modules
有权
用于低成本，高性能微波和毫米波模块的封装
- Patent Title: Packaging for low-cost, high-performance microwave and millimeter wave modules
- Patent Title (中): 用于低成本，高性能微波和毫米波模块的封装
-
Application No.: US11670952Application Date: 2007-02-02
-
Publication No.: US08395256B2Publication Date: 2013-03-12
- Inventor: Ronald D. Boesch , Edwin John Nealis , Costel Nicolae
- Applicant: Ronald D. Boesch , Edwin John Nealis , Costel Nicolae
- Applicant Address: US NC Morrisville
- Assignee: Harris Stratex Networks Operating Corporation
- Current Assignee: Harris Stratex Networks Operating Corporation
- Current Assignee Address: US NC Morrisville
- Agency: Sheppard Mullin Richter & Hampton LLP
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
Microwave or millimeter wave system packaging having a system with a baseplate, transition board and cover. The baseplate includes microwave or millimeter wave components attached thereto. The transition board includes a first connector attached to a first side thereof and operatively connected to the components, and a second connector attached to a second side thereof and operatively connected to the components through the board. The cover and baseplate form a cavity containing the board and components, and the second connector may be operatively connected to a third connector such as a printed circuit board disposed outside of the cavity and on a higher level assembly. The transition board may further include a fourth connector operatively connected to the components for providing a signal to an external component or device or receiving a signal from an external component or device.
Public/Granted literature
- US20080188098A1 PACKAGING FOR LOW-COST, HIGH-PERFORMANCE MIRCOWAVE AND MILLIMETER WAVE MODULES Public/Granted day:2008-08-07
Information query
IPC分类:
