Invention Grant
- Patent Title: Textile for connection of electronic devices
- Patent Title (中): 用于连接电子设备的纺织品
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Application No.: US12444419Application Date: 2007-10-03
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Publication No.: US08395317B2Publication Date: 2013-03-12
- Inventor: Rabin Bhattacharya
- Applicant: Rabin Bhattacharya
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips Electronics N.V.
- Current Assignee: Koninklijke Philips Electronics N.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP06122040 20061010; EP07106514 20070419
- International Application: PCT/IB2007/054013 WO 20071003
- International Announcement: WO2008/044167 WO 20080417
- Main IPC: H01J1/62
- IPC: H01J1/62

Abstract:
A textile (100; 300; 400) having a multi-layer warp which includes an upper warp layer (101) comprising an upper array of conductive warp yarns (104a-b; 303a-e; 406a-b), a lower warp layer (102) comprising a lower array of conductive warp yarns (106a-b; 306a-e; 421a-d), and an intermediate warp layer (103) arranged between the upper (101) and lower (102) warp layers. The textile further includes a weft in which a first set of conductive weft yarns (108; 302a-f; 407a-b) cross the upper array of conductive warp yarns (104a-b, 303a-e; 406a-b), such that electrical contact is achieved there between, and a second set of conductive weft yarns (109a-b; 305a-f; 424, 430, 440) cross the lower array of conductive warp yarns (106a-b; 306a-e; 421a-d), such that electrical contact is achieved there between. The second set of conductive weft yarns (109a-b; 305a-f; 424, 430, 440) form loops (110; 425, 431, 441) around non-conductive warp yarns in the upper (101) and intermediate (103) warp layers, each of the loops (110; 425, 431, 441) providing a first upper layer connection point (307; 408-410) for enabling connection of an electronic device (309; 401-403) between the first upper layer connection point (307; 408-410) and a second upper layer connection point (308).
Public/Granted literature
- US20100013406A1 TEXTILE FOR CONNECTION OF ELECTRONIC DEVICES Public/Granted day:2010-01-21
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