Methods and devices for cooling electronic circuits having at least one heat source are disclosed and described. One such thermally dynamic electronic device may include a layer of diamond material coated on a support substrate, and circuitry disposed on the layer of diamond material, the diamond material being configured to accelerate movement of heat away from the circuitry. Although the diamond material may be any known diamond material that functions to accelerate heat transfer, in one aspect the diamond material may be diamond-like carbon. In one specific aspect, the diamond-like carbon may be amorphous carbon. In another aspect, the diamond material may be crystalline diamond.