Invention Grant
- Patent Title: Solid-state imaging device, manufacturing method thereof, and electronic apparatus
- Patent Title (中): 固态成像装置及其制造方法以及电子装置
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Application No.: US12660211Application Date: 2010-02-23
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Publication No.: US08395692B2Publication Date: 2013-03-12
- Inventor: Hajime Nakayama
- Applicant: Hajime Nakayama
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: JPP2009-050771 20090304
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L23/053 ; H01L27/00

Abstract:
A solid-state imaging device includes: a plurality of photoelectric conversion units disposed on an imaging surface of a substrate; and a plurality of inner-layer lenses that are disposed in correspondence with each of the plurality of photoelectric conversion units on the upper side of the photoelectric conversion units and are formed in shapes protruding in directions toward the photoelectric conversion units, wherein each of the plurality of inner-layer lenses is formed to have different lens shapes in the center and in the periphery of the imaging surface.
Public/Granted literature
- US20100225791A1 Solid-state imaging device, manufacturing method thereof, and electronic apparatus Public/Granted day:2010-09-09
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