Invention Grant
- Patent Title: Coupling assembly for a foldable electronic device
- Patent Title (中): 用于可折叠电子设备的耦合组件
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Application No.: US12980410Application Date: 2010-12-29
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Publication No.: US08395893B2Publication Date: 2013-03-12
- Inventor: Roger Harmon , Jonathan Hewitt
- Applicant: Roger Harmon , Jonathan Hewitt
- Applicant Address: US IL Libertyville
- Assignee: Motorola Mobility, Inc.
- Current Assignee: Motorola Mobility, Inc.
- Current Assignee Address: US IL Libertyville
- Agency: The Watson I.P. Group, PLC
- Agent Jovan N. Jovanovic; Lawrence J. Chapa
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F3/02 ; H04M1/00

Abstract:
An electronic device comprising a first housing, a second housing and a hinge assembly. The first housing element has an inward surface and an outward surface and a side end. The second housing has an inward surface and an outward surface and a side end. The hinge assembly couples the first housing element and the second housing element about the respective side ends of the first and second housing elements, and facilitates rotation between a collapsed orientation and a deployed. The hinge assembly further includes a first hinge member and a second hinge member. The first hinge member is fixed to the first housing element. The second hinge member is slidably coupled to the second housing element. The first and second hinge members are rotatably coupled to each other about an axis of rotation, and, the second housing element rotates relative to the first housing element. Furthermore, the second housing element translates relative to the first housing element and the second hinge member between a compressed position and a fully extended position.
Public/Granted literature
- US20110157799A1 Coupling assembly for a foldable electronic device Public/Granted day:2011-06-30
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