Invention Grant
- Patent Title: Redundant cooling systems and methods
- Patent Title (中): 冗余冷却系统和方法
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Application No.: US11678590Application Date: 2007-02-24
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Publication No.: US08395896B2Publication Date: 2013-03-12
- Inventor: Christian L. Belady
- Applicant: Christian L. Belady
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Redundant cooling systems and methods are disclosed. In an exemplary embodiment, a method for redundant cooling system of computer systems and other electronics may comprise thermally connecting a cooling fluid to one or more heat-generating components to absorb heat from the heat-generating components during operation. The method may also comprise thermally connecting the cooling fluid to a primary coolant and a secondary coolant. The method may also comprise exchanging heat between the cooling fluid and the primary coolant or the secondary coolant to remove heat from the cooling fluid even if one of the cooling sources is unavailable.
Public/Granted literature
- US20080205003A1 Redundant Cooling Systems And Methods Public/Granted day:2008-08-28
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