Invention Grant
US08395927B2 Memory cell with resistance-switching layers including breakdown layer
有权
具有电阻切换层的存储单元包括击穿层
- Patent Title: Memory cell with resistance-switching layers including breakdown layer
- Patent Title (中): 具有电阻切换层的存储单元包括击穿层
-
Application No.: US13157208Application Date: 2011-06-09
-
Publication No.: US08395927B2Publication Date: 2013-03-12
- Inventor: Franz Kreupl , Chu-Chen Fu , Yibo Nian
- Applicant: Franz Kreupl , Chu-Chen Fu , Yibo Nian
- Applicant Address: US CA Milpitas
- Assignee: SanDisk 3D LLC
- Current Assignee: SanDisk 3D LLC
- Current Assignee Address: US CA Milpitas
- Agency: Vierra Magen Marcus LLP
- Main IPC: G11C11/00
- IPC: G11C11/00

Abstract:
A memory device in a 3-D read and write memory includes memory cells. Each memory cell includes a resistance-switching memory element (RSME) in series with a steering element. The RSME has a resistance-switching layer, a conductive intermediate layer, and first and second electrodes at either end of the RSME. A breakdown layer is electrically between, and in series with, the second electrode and the intermediate layer. The breakdown layer maintains a resistance of at least about 1-10 MΩ while in a conductive state. In a set or reset operation of the memory cell, an ionic current flows in the resistance-switching layers, contributing to a switching mechanism. An electron flow, which does not contribute to the switching mechanism, is reduced due to scattering by the conductive intermediate layer, to avoid damage to the steering element. Particular materials and combinations of materials for the different layers of the RSME are provided.
Public/Granted literature
- US20110310656A1 Memory Cell With Resistance-Switching Layers Including Breakdown Layer Public/Granted day:2011-12-22
Information query