Invention Grant
- Patent Title: Receiving device including impedance control circuit and semiconductor device including impedance control circuit
- Patent Title (中): 接收装置包括阻抗控制电路和包括阻抗控制电路的半导体装置
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Application No.: US12320802Application Date: 2009-02-05
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Publication No.: US08396164B2Publication Date: 2013-03-12
- Inventor: Youichirou Suzuki , Noboru Maeda , Takashi Nakano , Kazuyoshi Nagase , Koji Kondo , Shigeki Takahashi , Yoshihiko Ozeki
- Applicant: Youichirou Suzuki , Noboru Maeda , Takashi Nakano , Kazuyoshi Nagase , Koji Kondo , Shigeki Takahashi , Yoshihiko Ozeki
- Applicant Address: JP Kariya JP Nishio
- Assignee: DENSO CORPORATION,Nippon Soken, Inc.
- Current Assignee: DENSO CORPORATION,Nippon Soken, Inc.
- Current Assignee Address: JP Kariya JP Nishio
- Agency: Posz Law Group, PLC
- Priority: JP2008-67710 20080317; JP2008-96464 20080402
- Main IPC: H03K9/00
- IPC: H03K9/00 ; H04L27/00
Abstract:
A receiving device includes a receiving circuit and an impedance control circuit. The receiving circuit receives a signal transmitted through a communication line. The impedance control circuit is coupled with the receiving circuit and has a detecting part. The detecting part detects a physical value of the signal and the physical value includes at least one of a voltage, an electric current, and an electric power. The impedance control circuit changes an input impedance based on the detected value so that a ringing of the signal is reduced.
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