An opto-electric hybrid module capable of shortening the distance between a light-emitting section or a light-receiving section of a semiconductor chip and a reflecting surface formed in a core to reduce optical losses between an opto-electric conversion substrate section and an optical waveguide section, and a method of manufacturing the same. A recessed portion (3a) is formed in a surface of an over cladding layer (3) of the optical waveguide section (W1). At least part of the light-emitting section (7a) or the light-receiving section of the semiconductor chip (7) for opto-electric conversion and at least part of a loop portion (8a) of a bonding wire (8) in the opto-electric conversion substrate section (E1) are positioned within the recessed portion (3a). This brings the light-emitting section (7a) or the light-receiving section of the semiconductor chip (7) and the reflecting surface (2a) formed in the core (2) closer to each other.