Invention Grant
- Patent Title: Method and system for implementing virtual metrology in semiconductor fabrication
- Patent Title (中): 在半导体制造中实现虚拟计量的方法和系统
-
Application No.: US12731407Application Date: 2010-03-25
-
Publication No.: US08396583B2Publication Date: 2013-03-12
- Inventor: Po-Feng Tsai , Andy Tsen , Jo Fei Wang , Jong-I Mou
- Applicant: Po-Feng Tsai , Andy Tsen , Jo Fei Wang , Jong-I Mou
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
The present disclosure provides a method of fabricating a semiconductor device. The method includes collecting a plurality of manufacturing data sets from a plurality of semiconductor processes, respectively. The method includes normalizing each of the manufacturing data sets in a manner so that statistical differences among the manufacturing data sets are reduced. The method includes establishing a database that includes the normalized manufacturing data sets. The method includes normalizing the database in a manner so that the manufacturing data sets in the normalized database are statistically compatible with a selected one of the manufacturing data sets. The method includes predicting performance of a selected one of the semiconductor processes by using the normalized database. The selected semiconductor process corresponds to the selected manufacturing data set. The method includes controlling a semiconductor processing machine in response to the predicted performance.
Public/Granted literature
- US20110238198A1 METHOD AND SYSTEM FOR IMPLEMENTING VIRTUAL METROLOGY IN SEMICONDUCTOR FABRICATION Public/Granted day:2011-09-29
Information query