Invention Grant
- Patent Title: Ceiling wiring access point device
- Patent Title (中): 天花接线接入点设备
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Application No.: US13159829Application Date: 2011-06-14
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Publication No.: US08397451B2Publication Date: 2013-03-19
- Inventor: Jeff Pirner
- Applicant: Jeff Pirner
- Applicant Address: US KS Shawnee
- Assignee: Hepacart, Inc.
- Current Assignee: Hepacart, Inc.
- Current Assignee Address: US KS Shawnee
- Agency: Spencer Fane Britt & Browne LLP
- Main IPC: E04C2/52
- IPC: E04C2/52

Abstract:
A ceiling wiring access point device is comprised of a frame panel that can be temporarily placed in a grid ceiling system during the installation of wire and cable into a ceiling space. The frame panel has an opening through which wire and cable may be inserted as it is threaded up into the ceiling. The internal edges of the opening are provided with roller members to provide a relative frictionless edge against which the wires may pass. Dust guards are provided at the opening to prevent debris from the ceiling area from falling to the room below.
Public/Granted literature
- US20110308179A1 CEILING WIRING ACCESS POINT DEVICE Public/Granted day:2011-12-22
Information query
IPC分类: